Low Power Processing and I/O Board

Ordering Info
The IXI-5 Processing and I/O board features the latest in high performance, low power computing in a compact form factor. An integrated ARM Cortex-A9 dual-core System on Chip (SoC) allows the board to operate as a standalone single-board computer or system co-processor. As an SBC, the IXI-5 runs Linux with full access to integrated onboard RAM and I/O devices including dual Ethernet ports, dual UARTS (RS-232) and USB On-The-Go. This allows for the device to be used by itself without a host processor or backplane for applications requiring extremely small size, weight and power (SWaP). Power is provided through a PCIe x1 port and under 10 Watts is required to utilize all available functionality. When used as a co-processor, the device can be used to augment existing processing, offloading critical tasks from the host system. The off board host processor can run a different operating system such as Windows, Solaris, or VxWorks while the board itself runs Linux. Drivers are provided for the host operating system to easily allow for data transfer to/from the board via DMA and interrupts for efficient operation with minimal effects on host operating code. A development system is provided to easily allow users to create their own application code and/or services and download, store and run them on the board where they can be setup to automatically run each time the board is powered on. In addition the FPGA is available to be used for additional custom I/O or processing and can be mapped directly into the RAM accessible by operating code running under Linux. This powerful feature ensures that extremely time critical tasks can be run without interference from other competing operating code. An optional NTDS A/B/C/H parallel channel can be included on the board. The NTDS channel is accessed by onboard code using a software driver that is backward compatible with IXI Technology NTDS boards and drivers. A driver is provided for access to the NTDS channel from the host and it is therefore possible to swap other IXI Technology NTDS boards with the IXI-5 board without changes to current NTDS operating code running on the host while adding additional co-processing capability and I/O to the existing system. The IXI-5 is comprised of a main board and expansion board containing the ARM processor and FPGA, 2 Gigabits of accessible DDR3 RAM, 1 Gigabit of storage, dual Gigabit Ethernet ports, a USB On-The-Go port, and dual RS-232 ports while staying within the mechanical and power envelopes of a single PCI Express x1 slot. The addition of the optional NTDS Parallel A/B/C/H channel does not change any mechanical or power envelopes. The main board and expansion board can be modified to integrate other interfaces to meet the requirements of individual projects such as fiber Ethernet, MIL-STD-1553, ARINC-429, IRIG-B, GPS, RS-422/485, NTDS Serial D/E or ATDS. Board form factor can be changed to meet project requirements. Contact IXI Technology for additional details. Available with a standard height or low profile faceplate, I/O cabling can be configured to maximize the usage of slot space and height depending upon individual requirements. A BSP is included with device drivers for all interfaces along with a development package for simplified development, testing and debugging. Host drivers are available for Windows and Linux but can be ported to other operating systems such as Solaris, VxWorks, LynxOS and FreeBSD as required.
General Specifications
  • CPU
    Dual-core ARM Cortex-A9 System-on-Chip (SoC)
    @ 800MHz
  • Volatile RAM Non-
    2 Gigabit (256 Megabyte) DDR3 RAM
  • Volatile RAM Ports
    1 Gigabit (128 Megabyte) NOR Flash
  • PCIe Bus Interface
    PCI Express Base Specification, Revision 1.0a
  • Form Factor
    Standard or low profile, half length PCIe
    With standard profile faceplate:
    4.13” X 6.6” (104.9mm X 167.65mm)
    With low profile faceplate:
    2.53” X 6.6” (64.26mm X 167.65mm)
  • Weight
    4.1 oz.
  • Power Consumption
    +12VDC Average 5.0W
    +3.3VDC Average 4.4W
  • Temperature
    Operating: 0°C to +55°C
    Storage: -40°C to +85°C
  • Shock
    MIL-STD-810F, method 516.4,
    procedure VI (bench handling)
  • Vibration
    Random: 20-200Hz/0.01 g²/Hz Sine
    Peak: 5-28Hz/g
  • Relative Humidity
    0% to 95% (non-condensing)
  • Altitude
    Operating: 15,000 ft.
    Transport: 40,000 ft.
  • Optional NTDS Interface
    MIL-STD-1397C Parallel
    Types A, B, C or H, s/w selectable
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